SK hynix Inc. has announced that it has started volume production of its newest AI memory product, HBM3E, for supply to a customer in late March. HBM3E is the extended version of HBM3, a high-value and high-performance memory that vertically interconnects multiple DRAM chips, increasing data processing speed.
SK hynix’s HBM3E is the industry’s best AI memory in speed and heat control, processing up to 1.18TB of data per second and coming with a 10% improvement in heat-dissipation performance.
Read more: SK hynix Begins Volume Production of Industry’s First HBM3E
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